Know-How • Chip Packages •

DIP Package

Chip within DIP packageDIP (Dual In-Line Package)
= DIL (Dual In-Line)

Distance between pins: 2.54mm (0.1 inch)
Distance between pin rows: 7.62mm (0.3 inch), 15.24mm (0.6 inch) oder 22.86mm (0.9 inch)

PLCC Package

Chip within PLCC PackagePLCC (Plastic Leaded Chip Carrier)
LCC (Leaded Chip Carrier)

Distance between pins: 1.27mm (0.05 inch)

Number of pins Length Width Height
18 13.39mm 8.18mm 3.40mm
20 10.03mm 10.03mm 4.57mm
28 12.57mm 12.57mm 4.57mm
32 15.11mm 12.57mm 3.55mm
44 17.65mm 17.65mm 4.57mm
52 20.19mm 20.19mm 4.57mm
68 25.27mm 25.27mm 4.57mm
84 30.35mm 30.35mm 4.57mm
124 42.93mm 42.93mm 4.57mm

TSOP and TSSOP Package

Chip within TSOP PackageTSOP (Thin Small Outline Package)
TSSOP (Thin Shrunk Small Outline Package)

QFP, PQFP and TQFP Package

Chip within QFP PackageQFP (Quad Flat Pack)
PQFP (Plastic Quad Flat Pack Lidded)
TQFP (Thin Quad Flat Pack)

 

Number of pins Length Width Height Pin distance
44 17.2mm 17.2mm 2.90mm 0.8mm
64 17.2mm 17.2mm 2.90mm 0.8mm
80 17.2mm 17.2mm 2.90mm 0.65mm
136 31.2mm 31.2mm 3.30mm 0.8mm
168 31.2mm 31.2mm 3.30mm 0.65mm

 

Number of pins Length Width Height Pin distance
54 25.6mm 19.6mm 2.90mm 1.0mm
60 25.6mm 19.6mm 2.90mm 1.0mm
64 25.6mm 19.6mm 2.90mm 1.0mm
80 25.6mm 19.6mm 2.90mm 0.8mm
100 25.6mm 19.6mm 2.90mm 0.65mm

SOP, SOIC and SSOP Package

Chip within SOP PackageSOIC (Small Outline IC “Gull Wing Style”)
SSOP (Shrunk Small Outline Package)

Distance between pins SOP: 1.27mm (0.05 inch)
Distance between pins SSOP: 0.4mm (0.016 inch), 0.5mm (0.02 inch) oder 0.65mm (0.026 inch).

10 Good Reasons

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