Know-How • Chip Gehäuseformen
DIP Gehäuse
DIP
(Dual In-Line Package)
= DIL (Dual In-Line)
Bauform: Gehäuse mit Pins zum Durchstecken.
Raster (Pinabstände): 2.54mm (0.1 inch)
Pinabstand Pinreihe zu Pinreihe 7.62mm (0.3 inch), 15.24mm (0.6 inch)
oder 22.86mm (0.9 inch)
PLCC Gehäuse
PLCC
(Plastic Leaded Chip Carrier)
LCC (Leaded Chip Carrier)
Bauform: Pins an allen vier Seiten, J-Anschluß
Raster (Pinabstände): 1.27mm (0.05 inch)
| Anzahl der Pins | Länge | Breite | Höhe |
| 18 | 13.39mm | 8.18mm | 3.40mm |
| 20 | 10.03mm | 10.03mm | 4.57mm |
| 28 | 12.57mm | 12.57mm | 4.57mm |
| 32 | 15.11mm | 12.57mm | 3.55mm |
| 44 | 17.65mm | 17.65mm | 4.57mm |
| 52 | 20.19mm | 20.19mm | 4.57mm |
| 68 | 25.27mm | 25.27mm | 4.57mm |
| 84 | 30.35mm | 30.35mm | 4.57mm |
| 124 | 42.93mm | 42.93mm | 4.57mm |
TSOP und TSSOP Gehäuse
TSOP
(Thin Small Outline Package)
TSSOP (Thin Shrunk Small Outline Package)
Bauform: SMD, oberflächenmontiert
QFP, PQFP und TQFP Gehäuse
QFP
(Quad Flat Pack)
PQFP (Plastic Quad Flat Pack Lidded)
TQFP (Thin Quad Flat Pack)
Bauform: SMD, oberflächenmontiert
Quadratische Bauform:
| Anzahl der Pins | Länge | Breite | Höhe | Raster |
| 44 | 17.2mm | 17.2mm | 2.90mm | 0.8mm |
| 64 | 17.2mm | 17.2mm | 2.90mm | 0.8mm |
| 80 | 17.2mm | 17.2mm | 2.90mm | 0.65mm |
| 136 | 31.2mm | 31.2mm | 3.30mm | 0.8mm |
| 168 | 31.2mm | 31.2mm | 3.30mm | 0.65mm |
Rechteckige Bauform:
| Anzahl der Pins | Länge | Breite | Höhe | Raster |
| 54 | 25.6mm | 19.6mm | 2.90mm | 1.0mm |
| 60 | 25.6mm | 19.6mm | 2.90mm | 1.0mm |
| 64 | 25.6mm | 19.6mm | 2.90mm | 1.0mm |
| 80 | 25.6mm | 19.6mm | 2.90mm | 0.8mm |
| 100 | 25.6mm | 19.6mm | 2.90mm | 0.65mm |
SOP, SOIC und SSOP Gehäuse
SOIC
(Small Outline IC “Gull Wing Style”)
SSOP (Shrunk Small Outline Package)
Bauform: SMD, oberflächenmontiert
Raster (Pinabstände) SOP: 1.27mm (0.05 inch)
Raster (Pinabstände) SSOP: 0.4mm (0.016 inch), 0.5mm (0.02 inch)
oder 0.65mm (0.026 inch).
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